San Diego, CA, United States of America

Shinichi Hira

USPTO Granted Patents = 3 

Average Co-Inventor Count = 3.6

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2016-2022

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3 patents (USPTO):Explore Patents

Title: Innovations by Inventor Shinichi Hira

Introduction

Shinichi Hira is a notable inventor based in San Diego, California. He has made significant contributions to the field of electronic device packaging, holding three patents that showcase his innovative approach to technology. His work focuses on enhancing the reliability and efficiency of electronic devices through advanced materials and design.

Latest Patents

One of Hira's latest patents is for ceramic feedthrough assemblies for electronic devices with metal housings. This invention features a ceramic feedthrough assembly that includes a feedthrough interface sleeve brazed to a ceramic feedthrough body. The design allows for integration within an electronic device, creating a hermetically sealed environment. The embedded electrical conductor ensures reliable connectivity within the device.

Another significant patent is the lead package and method for minimizing deflection in microelectronic packaging. This innovation employs a two-step manufacturing process that minimizes package deflection and mechanical stress. By using a ceramic insulator and a symmetrically balanced three-layer structure, Hira's design improves thermal dissipation and enhances the reliability of microelectronic packages.

Career Highlights

Shinichi Hira has worked with prominent companies such as Kyocera International, Inc. and Kyocera America, Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in electronic packaging.

Collaborations

Hira has collaborated with talented individuals in his field, including Franklin Kim and Mark Eblen. These partnerships have contributed to the advancement of his projects and the successful development of his patents.

Conclusion

Shinichi Hira's contributions to electronic device packaging through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and improve the reliability of electronic devices.

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