IDiyas

For the Inventor, By the Inventor

San Diego, CA, United States of America

Kyocera America, Inc.


USPTO Granted Patents = 27



Forward Citations = 343

Loading Chart...
Loading Chart...

47 inventors (with patents filed for the assignee):

goldMedal Nobuaki Miyauchi (6 out of 7 patents)

silverMedal Aki Nomura (5 out of 5 patents)

bronzeMedal Paul Garland (4 out of 4 patents)

4.  Joshua Lobsinger (3 out of 3 patents)

5.  Henry Beppu (3 out of 3 patents)

6.  Chong-il Park (3 out of 3 patents)

7.  Hiroshi Yonemasu (3 out of 3 patents)

8.  Bakji Cho (3 out of 3 patents)

9.  Gerardo Aguirre (2 out of 4 patents)

10.  Franklin Kim (2 out of 4 patents)

11.  Yozo Satoda (2 out of 8 patents)

12.  Jeffrey Venegas (2 out of 2 patents)

13.  Linda Luu (2 out of 2 patents)

14.  John Washington McCoy (2 out of 2 patents)

15.  James Kyo Long (2 out of 2 patents)


27 patents:

1. 9331000 - Heat management in electronics packaging (2016-05-03),
2. 8547187 - Printed circuit board impedance matching step for microwave (millimeter wave) devices (2013-10-01),
3. 7808341 - Broadband RF connector interconnect for multilayer electronic packages (2010-10-05),
4. 7582964 - Semiconductor package having non-ceramic based window frame (2009-09-01),
5. 7298046 - Semiconductor package having non-ceramic based window frame (2007-11-20),
6. 7053729 - Impedence matching along verticle path of microwave vias in multilayer packages (2006-05-30),
7. 6900525 - Semiconductor package having filler metal of gold/silver/copper alloy (2005-05-31),
8. 6796725 - Opto-electronic package for integrated sealing of optical fibers (2004-09-28),
9. 6727117 - Semiconductor substrate having copper/diamond composite material and method of making same (2004-04-27),
10. 6703559 - Feedthrough assembly having cut-out areas in metal housing adjacent ceramic feedthrough (2004-03-09),
11. 6441697 - Ultra-low-loss feedthrough for microwave circuit package (2002-08-27),
12. 6204448 - High frequency microwave packaging having a dielectric gap (2001-03-20),
13. 6046707 - Ceramic multilayer helical antenna for portable radio or microwave (2000-04-04),
14. 5482735 - Method for making multi-layer ceramic packages (1996-01-09),
15. 5345038 - Multi-layer ceramic packages (1994-09-06),
Kyocera America, Inc. is a subsidiary of Kyocera Corporation, a global leading manufacturer of industrial and consumer electronics. They specialize in providing a wide range of innovative products and solutions including advanced ceramic components, electronic devices, solar power generating systems, mobile phones, printers, and more. With a commitment to environmental sustainability, Kyocera America aims to contribute to society through their cutting-edge technologies.
This text is generated by artificial intelligence and may not be accurate.

logo

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

27 Patents

#210 in San Diego, CA

#2,842 in California

#11,985 in US

#23,254 in the World

...
San Diego, CA, United States of America

Kyocera America, Inc.

Forward Citations = 343

47 inventors:

goldMedal Nobuaki Miyauchi (6 out of 7 patents)

silverMedal Aki Nomura (5 out of 5 patents)

bronzeMedal Paul Garland (4 out of 4 patents)

4.  Joshua Lobsinger (3 out of 3 patents)

5.  Henry Beppu (3 out of 3 patents)

Please report any incorrect information to support@idiyas.com
Loading…