For the Inventor, By the Inventor

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San Diego, CA, United States of America

Kyocera America, Inc.

USPTO Granted Patents = 27

% Expired Patents = 3.7

CIPO Patents = 4

EPO Patents = 5

Forward Citations = 358

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41 inventors (with patents filed for the assignee):

Nobuaki Miyauchi (6 out of 7 patents)

Aki Nomura (5 out of 5 patents)

Paul Garland (4 out of 4 patents)

4. Joshua Lobsinger (3 out of 3 patents)

5. Henry Beppu (3 out of 3 patents)

6. Chong-il Park (3 out of 3 patents)

7. Hiroshi Yonemasu (3 out of 3 patents)

8. Bakji Cho (3 out of 3 patents)

9. Gerardo Aguirre (2 out of 4 patents)

10. Franklin Kim (2 out of 4 patents)

11. Yozo Satoda (2 out of 8 patents)

12. Jeffrey Venegas (2 out of 2 patents)

13. Linda Luu (2 out of 2 patents)

14. John Washington McCoy (2 out of 2 patents)

15. James Kyo Long (2 out of 2 patents)

Core Competencies:

Heat Management

Impedance Matching

Microwave Devices

RF Connector

Ceramic Packages

Opto-Electronic Packages

Integrated Circuits

Dielectric Gap

Copper-Diamond Composite

Low Capacitance

Multilayer Packages

Filler Metals

27 patents: Sort by Forward Citations

1. 9331000 - Heat management in electronics packaging (2016-05-03),

2. 8547187 - Printed circuit board impedance matching step for microwave (millimeter wave) devices (2013-10-01),

3. 7808341 - Broadband RF connector interconnect for multilayer electronic packages (2010-10-05),

4. 7582964 - Semiconductor package having non-ceramic based window frame (2009-09-01),

5. 7298046 - Semiconductor package having non-ceramic based window frame (2007-11-20),

6. 7053729 - Impedence matching along verticle path of microwave vias in multilayer packages (2006-05-30),

7. 6900525 - Semiconductor package having filler metal of gold/silver/copper alloy (2005-05-31),

8. 6796725 - Opto-electronic package for integrated sealing of optical fibers (2004-09-28),

9. 6727117 - Semiconductor substrate having copper/diamond composite material and method of making same (2004-04-27),

10. 6703559 - Feedthrough assembly having cut-out areas in metal housing adjacent ceramic feedthrough (2004-03-09),

11. 6441697 - Ultra-low-loss feedthrough for microwave circuit package (2002-08-27),

12. 6204448 - High frequency microwave packaging having a dielectric gap (2001-03-20),

13. 6046707 - Ceramic multilayer helical antenna for portable radio or microwave (2000-04-04),

14. 5482735 - Method for making multi-layer ceramic packages (1996-01-09),

15. 5345038 - Multi-layer ceramic packages (1994-09-06),

Company Overview

Kyocera America, Inc., headquartered in San Diego, California, is a subsidiary of Kyocera Corporation, specializing in advanced technology solutions across various sectors. The company develops and manufactures a diverse range of products, including telecommunications equipment, printers, and industrial ceramics. With a strong emphasis on innovation, Kyocera is involved in research and development in areas such as electronics, solar energy, and medical devices, contributing to sustainable and efficient technologies in North America and beyond.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

27 Patents

#221 in San Diego, CA

#2,934 in California

#12,428 in US

#24,034 in the World

San Diego, CA, United States of America

Kyocera America, Inc.

Forward Citations = 358

41 inventors:

Nobuaki Miyauchi (6 out of 7 patents)

Aki Nomura (5 out of 5 patents)

Paul Garland (4 out of 4 patents)

4. Joshua Lobsinger (3 out of 3 patents)

5. Henry Beppu (3 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Kyocera America, Inc.. Retrieved from https://idiyas.com/company/kyocera-america

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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