The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8547187 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 01, 2013

Filed:

Sep. 30, 2010
Applicants:

Hsueh-yuan Pao, San Jose, CA (US);

Jerardo Aguirre, San Diego, CA (US);

Paul Sargis, Livermore, CA (US);

Inventors:

Hsueh-Yuan Pao, San Jose, CA (US);

Jerardo Aguirre, San Diego, CA (US);

Paul Sargis, Livermore, CA (US);

Assignees:

Lawrence Livermore National Security, LLC., Livermore, CA (US);

Kyocera America, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 5/00 (2006.01); H03H 7/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.


Find Patent Forward Citations

Pao, Hsueh-Yuan. (2013). Printed circuit board impedance matching step for microwave (millimeter wave) devices (U.S. Patent No. 8547187). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8547187

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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