The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2005
Filed:
May. 21, 2003
Joshua David Lobsinger, San Diego, CA (US);
Michael John Shane, Carlsbad, CA (US);
Ronaldo Francisco Hernandez Brosas, San Diego, CA (US);
Joshua David Lobsinger, San Diego, CA (US);
Michael John Shane, Carlsbad, CA (US);
Ronaldo Francisco Hernandez Brosas, San Diego, CA (US);
Kyocera America, Inc., San Diego, CA (US);
Abstract
A semiconductor package to which a potential difference is applied has two or more of the components thereof bound together using a filler metal. The filler metal is a solid solution structure in which the metallic components are atomically dispersed, and may comprise an alloy of gold, silver and copper. A preferred form of the filler metal comprises 60Au20Ag20Cu. Such filler metals in accordance with the invention provide the advantages of silver-based filler metals without the silver migration that leads to eventual shorting of the semiconductor package. When water condenses to form a continuous layer thereof within the semiconductor package due to moisture seeping into the package and temperature changes, the silver within the filler metal does not ionize, and therefore a buildup of silver deposits and eventual shorting of the package does not occur.