Chong-il Park

Title: Innovations of Chong-il Park

Introduction

Chong-il Park is a notable inventor based in San Diego, California. He has made significant contributions to the field of integrated circuit packaging. With a total of three patents to his name, his work focuses on enhancing the durability and functionality of ceramic components.

Latest Patents

Chong-il Park's latest patents include an "Apparatus for manufacturing ceramic chip-resistant chamfered integrated circuits." This invention features a ceramic chip-resistant chamfered integrated circuit package, which is designed to improve the structural integrity of the components. The exposed-surface edge of each short end of a ceramic package component is crafted with an integral chamfer at an angle ranging from about 20 degrees to about 85 degrees. The height of the chamfer is specified to be from about 20% to about 67% of the thickness of the ceramic package component. The preferred angle of the chamfer is between 50 degrees and 70 degrees, with a height of about 30% to 50% of the thickness. This innovative method allows for the formation of chamfers without causing localized compaction of the ceramic powder starting material.

Another significant patent is the "Partially coated assembly structure and method for making a ceramic lid." This invention provides a ceramic lid for a hermetically sealed package for an EPROM circuit. The assembly structure includes a ceramic lid, a UV transparent lens, and two fixtures for supporting the lens in the lid. The method ensures that the UV transparent lens is hermetically sealed to the ceramic lid, preventing foreign particulate matter from contaminating the lens during the firing process.

Career Highlights

Chong-il Park is currently employed at Kyocera America, Inc., where he continues to innovate in the field of ceramic packaging. His work has been instrumental in advancing the technology used in integrated circuits.

Collaborations

Chong-il Park has collaborated with notable coworkers such as Takayasu Kizaki and Reiichi Yamada. Their combined expertise has contributed to the successful development of innovative solutions in their field.

Conclusion

Chong-il Park's contributions to the field of integrated circuit packaging through his patents demonstrate his commitment to innovation and excellence. His work continues to influence the industry and improve the reliability of electronic components.