The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 1992
Filed:
Aug. 05, 1991
Takayasu Kizaki, San Diego, CA (US);
Chong-il Park, San Diego, CA (US);
Reiichi Yamada, San Diego, CA (US);
Kyocera America, Inc., San Diego, CA (US);
Abstract
A ceramic chip-resistant chamfered integrated circuit package and an apparatus for and method of manufacture thereof. The exposed-surface edge of each short end of a ceramic package component (base and/or cap) are made with an integral chamfer at an angle of from about 20.degree. to about 85.degree. relative to the plane of the opposing inner surface of the component. The height H of the chamfer is from about 20% to about 67% of the thickness T of the ceramic package component. In particular, the preferred angle of the chamfer is from about 50.degree. to about 70.degree., with a preferred height H of about 30% to about 50% of the thickness T. The integral chamfer of each ceramic package component is made by means of an inventive die-press apparatus for inverted formation of the ceramic package component. The inventive method forms the chamfers without causing localized compaction of the ceramic powder starting material.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile