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Wilmington, DE, United States of America

Kulicke and Soffa Investments, Inc.

USPTO Granted Patents = 92

Trademarks = 3

Forward Citations = 1,922

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106 inventors (with patents filed for the assignee):

David T Beatson (14 out of 30 patents)

Christian Hoffman (9 out of 9 patents)

Eli Razon (8 out of 24 patents)

4. Gil Perlberg (8 out of 20 patents)

5. January Kister (6 out of 56 patents)

6. James E Eder (5 out of 13 patents)

7. Oded Yehoshua Licht (5 out of 7 patents)

8. Ali Reza Safabakhsh (5 out of 7 patents)

9. John Ditri (4 out of 16 patents)

10. Timothy W Ellis (4 out of 13 patents)

11. Nikhil Murdeshwar (4 out of 5 patents)

12. Mark A Eshelman (4 out of 6 patents)

13. Lee R Levine (4 out of 4 patents)

14. Andrew F Hmiel (3 out of 6 patents)

15. Jon W Brunner (3 out of 13 patents)

Core Competencies:

Bonding Tool

Capillary Technology

Fiber Alignment

Chip Level Packaging

Machine Vision Systems

Semiconductor Protection

Probe Apparatus

Laser Cutting

Wire Bonding

Dicing Blade

Energy Transfer Capillary

Wire Tensioning

92 patents: Sort by Forward Citations

1. 7077304 - Bonding tool with polymer coating (2006-07-18),

2. RE39018 - High speed method of aligning cutting lines of a workplace using patterns (2006-03-20),

3. 7004369 - Capillary with contained inner chamfer (2006-02-28),

4. 6997368 - Fiber alignment process using cornercube offset tool (2006-02-14),

5. 6960022 - Macrocomposite guideway and gib produced therefrom (2005-11-01),

6. 6955949 - System and method for reducing or eliminating semiconductor device wire sweep (2005-10-18),

7. 6953999 - High density chip level package for the packaging of integrated circuits and method to manufacture same (2005-10-11),

8. 6910612 - Capillary with contained inner chamfer (2005-06-28),

9. 6903880 - Method for providing plural magnified images (2005-06-07),

10. 6885104 - Semiconductor copper bond pad surface protection (2005-04-26),

11. 6872589 - High density chip level package for the packaging of integrated circuits and method to manufacture same (2005-03-29),

12. 6870684 - Multi-wavelength aperture and vision system and method using same (2005-03-22),

13. 6847122 - System and method for preventing and alleviating short circuiting in a semiconductor device (2005-01-25),

14. 6784556 - Design of interconnection pads with separated probing and wire bonding regions (2004-08-31),

15. 6778274 - Die attach process using cornercube offset tool (2004-08-17),

Kulicke and Soffa Investments, Inc. is a leading provider of semiconductor and electronic assembly equipment. With a history spanning over six decades, the company designs, manufactures, and sells advanced packaging and electronic assembly solutions for the global semiconductor and electronics industries. Their innovative products and solutions help customers increase productivity, reduce costs, and improve manufacturing yields. For more information, please visit their website.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

92 Patents

#59 in Wilmington, DE

#76 in Delaware

#3,924 in US

#8,129 in the World

Wilmington, DE, United States of America

Kulicke and Soffa Investments, Inc.

Forward Citations = 1,922

106 inventors:

David T Beatson (14 out of 30 patents)

Christian Hoffman (9 out of 9 patents)

Eli Razon (8 out of 24 patents)

4. Gil Perlberg (8 out of 20 patents)

5. January Kister (6 out of 56 patents)

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