Company Filing History:
Years Active: 1992-1999
Title: **Innovator Spotlight: Lee R. Levine**
Introduction
Lee R. Levine, an accomplished inventor located in New Tripoli, PA, has made significant contributions to the field of ultrasonic bonding technology. With a total of four patents to his name, Levine continues to push the boundaries of innovation and improve the efficiency of interconnection methodologies.
Latest Patents
Levine's latest patents include innovative designs that enhance the performance of ultrasonic wire bonding. His first notable patent is the **Multi-frequency Ultrasonic Wire Bonder and Method**. This invention features a multi-frequency ultrasonic generator paired with a multi-resonance frequency transducer. It is capable of operating at several usable resonance frequencies, and the controller linked to a power amplifier can independently apply power, voltage, or current profiles for each resonance frequency during bonding operations.
Another remarkable patent is the **Method of Making Constant Clearance Flat Link Fine Wire Interconnections**. This method involves pre-forming a length of fine wire while simultaneously creating a fine wire interconnection between two bonding points on a semiconductor device. The process encompasses teaching the locations of the die edges and a spatial plane, while employing automated tools to ensure accuracy and reliability in bond formation.
Career Highlights
Lee R. Levine is currently applying his expertise at Kulicke and Soffa Investments, Inc., where he contributes to pioneering advancements in ultrasonic wire bonding technologies. His inventive spirit and commitment to improving manufacturing processes make him a key figure in his industry.
Collaborations
Throughout his career, Levine has collaborated with notable colleagues such as William J. Holdgrafer and Michael J. Sheaffer. Their collective expertise and teamwork have driven forward innovative solutions that meet the needs of modern semiconductor applications.
Conclusion
Lee R. Levine's contributions to the ultrasonic bonding field not only showcase his inventive capabilities but also reflect a dedication to advancing technology. With four patents that significantly impact the efficiency of wire interconnections, Levine continues to represent the spirit of innovation in engineering. His work at Kulicke and Soffa Investments, Inc. positions him as a leader among inventors pushing the boundaries of what is possible in semiconductor manufacturing.