Company Filing History:
Years Active: 2002-2022
Title: Innovations by James E Eder in Semiconductor Bonding Technology
Introduction
James E Eder is a notable inventor based in Doylestown, PA (US), recognized for his contributions to semiconductor bonding technology. With a total of 13 patents to his name, Eder has made significant advancements in the field, particularly in the design and functionality of bonding machines.
Latest Patents
Eder's latest patents focus on systems and methods for bonding semiconductor elements. One of his notable inventions is a bonding machine that includes a support structure for supporting a substrate. The machine features a bond head assembly equipped with a bonding tool designed to bond multiple semiconductor elements to the substrate. It also incorporates an alignment structure with first alignment markings and an alignment element that can be placed on the alignment structure using the bonding tool. This alignment element includes second alignment markings. An imaging system is integrated to capture the relative positions of the first and second alignment markings. Furthermore, a computer system is configured to adjust the position of either the bonding tool or the support structure during the bonding process, ensuring precise alignment based on the relative positions of the markings.
Career Highlights
Throughout his career, James E Eder has worked with prominent companies in the semiconductor industry, including Kulicke and Soffa Industries, Inc. and Kulicke and Soffa Investments, Inc. His work has significantly impacted the efficiency and accuracy of semiconductor bonding processes.
Collaborations
Eder has collaborated with notable professionals in his field, including David T Beatson and Christian Hoffman. Their combined expertise has contributed to the development of innovative solutions in semiconductor technology.
Conclusion
James E Eder's work in semiconductor bonding technology showcases his innovative spirit and dedication to advancing the industry. His patents reflect a commitment to improving the precision and efficiency of bonding processes, making him a significant figure in the field.
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