For the Inventor, By the Inventor

Enter assignee name

Corvallis, OR, United States of America

Inpria Corporation

USPTO Granted Patents = 76

% Expired Patents = 1.3

EPO Patents = 9

Trademarks = 3

Forward Citations = 1,133

Loading Chart...

Loading Chart...

46 inventors (with patents filed for the assignee):

Stephen T Meyers (38 out of 38 patents)

Kai Jiang (37 out of 37 patents)

Jeremy T Anderson (37 out of 41 patents)

4. Douglas A Keszler (35 out of 58 patents)

5. Brian J Cardineau (34 out of 37 patents)

6. Alan J Telecky (30 out of 30 patents)

7. Joseph Burton Edson (24 out of 24 patents)

8. Andrew Grenville (20 out of 20 patents)

9. Jason K Stowers (19 out of 21 patents)

10. William Earley (13 out of 13 patents)

11. Michael K Kocsis (12 out of 16 patents)

12. Benjamin L Clark (11 out of 20 patents)

13. Thomas J Lamkin (10 out of 10 patents)

14. Peter De Schepper (9 out of 11 patents)

15. Dominick Smiddy (8 out of 8 patents)

Core Competencies:

Organometallic

Photoresist

Patterning

EUV Absorption

High Resolution

Radiation

Tin Dodecamers

Monoalkyl Tin

Inorganic Resists

Lithography

Patterned Layers

Metal Residue

76 patents: Sort by Forward Citations

1. 12767672 - Methods to produce organotin compositions with convenient ligand providing reactants (2026-10-20),

2. 12687778 - Gas-based development of organometallic resist in an oxidizing halogen-donating environment (2026-07-21),

3. 12631961 - Monoalkyl tin trialkoxides and/or monoalkyl tin triamides with low metal contamination and/or particulate contamination, and corresponding methods (2026-05-19),

4. 12630737 - Radiation sensitive organotin compositions having oxygen heteroatoms in hydrocarbyl ligand (2026-05-19),

5. 12595272 - Methods to produce organotin compositions with convenient ligand providing reactants (2026-04-07),

6. 12578646 - Organotin oxide hydroxide patterning compositions, precursors, and patterning (2026-03-17),

7. 12566377 - Multiple patterning with organometallic photopatternable layers with intermediate freeze steps (2026-03-03),

8. 12554195 - Radiation based patterning methods (2026-02-17),

9. 12522621 - Tin dodecamers and radiation patternable coatings with strong euv absorption (2026-01-13),

10. 12498641 - Process environment for inorganic resist patterning (2025-12-16),

11. 12487522 - Organometallic solution based high resolution patterning compositions and corresponding methods (2025-12-02),

12. 12443105 - Organotin oxide hydroxide patterning compositions, precursors, and patterning (2025-10-14),

13. 12416861 - Organometallic photoresist developer compositions and processing methods (2025-09-16),

14. 12399426 - Patterned organometallic photoresists and methods of patterning (2025-08-26),

15. 12360454 - Stabilized interfaces of inorganic radiation patterning compositions on substrates (2025-07-15),

Company Overview

Inpria Corporation, based in Corvallis, Oregon, specializes in the development of advanced organometallic patterning materials for semiconductor manufacturing. The company focuses on innovative photoresist technologies that enhance extreme ultraviolet (EUV) lithography processes, enabling high-resolution patterning essential for next-generation electronic devices. By leveraging unique compounds such as tin dodecamers and monoalkyl tin, Inpria aims to improve radiation absorption and overall performance in the semiconductor industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

76 Patents

#4 in Corvallis, OR

#61 in Oregon

#4,846 in US

#9,898 in the World

Corvallis, OR, United States of America

Inpria Corporation

Forward Citations = 1,133

46 inventors:

Stephen T Meyers (38 out of 38 patents)

Kai Jiang (37 out of 37 patents)

Jeremy T Anderson (37 out of 41 patents)

4. Douglas A Keszler (35 out of 58 patents)

5. Brian J Cardineau (34 out of 37 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Inpria Corporation. Retrieved from https://idiyas.com/company/inpria

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…