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Hwatsing (beijing) Technology Co., Ltd.

USPTO Granted Patents = 1

Forward Citations = 0

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4 inventors (with patents filed for the assignee):

Jie Liu (1 out of 49 patents)

Xinchun Lu (1 out of 7 patents)

Fangxin Tian (1 out of 1 patent)

4. Yingming Wu (1 out of 1 patent)

1 patent: Sort by Forward Citations

1. 12109664 - Method for determining thickness of metal film of wafer, polishing device, and medium (2024-10-08),

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USPTO Data Jan 1 1976 - Dec 23 2025

1 Patents

#1,163 in Beijing

#16,077 in China

Hwatsing (beijing) Technology Co., Ltd.

Forward Citations = 0

4 inventors:

Jie Liu (1 out of 49 patents)

Xinchun Lu (1 out of 7 patents)

Fangxin Tian (1 out of 1 patent)

4. Yingming Wu (1 out of 1 patent)

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