The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Jun. 27, 2024
Hwatsing (Beijing) Technology Co., Ltd., Beijing, CN;
Hwatsing (Beijing) Technology Co., Ltd., Beijing, CN;
Abstract
A method for measuring a thickness of a metal film, a polishing device, and a medium are provided. The method includes: determining a reference thickness of the metal film based on measurement signals, the measurement signals being indicative of measured thicknesses of different positions on the metal film; determining sub-adjustment parameters based on an adjustment parameter included in the reference thickness, wherein the adjustment parameter includes sub-adjustment parameters corresponding to topographies of different edges of the metal film; and adjusting, based on the sub-adjustment parameters, a coordinate value of a sampling point in a to-be-processed area of the metal film, processing, based on an adjusted coordinate value, an amplitude of the signal corresponding to the sampling point in the measurement signals, and determining a thickness of the metal film based on the processed signal amplitude.