% Expired Patents = 5.9

Forward Citations = 593

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3 inventors (with patents filed for the assignee):

Patrick O Weber (17 out of 22 patents)

Michael A Brueggeman (3 out of 3 patents)

Matthew M Salatino (1 out of 20 patents)

17 patents: Sort by Forward Citations

1. 7049166 - Methods and apparatus for making integrated circuit package including opening exposing portion of the IC (2006-05-23),

2. 6560122 - Chip package with molded underfill (2003-05-06),

3. 6495083 - Method of underfilling an integrated circuit chip (2002-12-17),

4. 6324069 - Chip package with molded underfill (2001-11-27),

5. 6316291 - Method of fabricating a non-laminate carrier substrate utilizing a mold (2001-11-13),

6. 6128195 - Transfer molded PCMCIA standard cards (2000-10-03),

7. 6038136 - Chip package with molded underfill (2000-03-14),

8. 5929522 - Semiconductor non-laminate package and method (1999-07-27),

9. 5798014 - Methods of making multi-tier laminate substrates for electronic device (1998-08-25),

10. 5776512 - Apparatus for encapsulating electronic packages (1998-07-07),

11. 5766986 - Method of transfer molding electronic packages and packages produced (1998-06-16),

12. 5728248 - Method for making a multi-tier laminate substrate with internal heat (1998-03-17),

13. 5689137 - Method for transfer molding standard electronic packages and apparatus (1997-11-18),

14. 5652463 - Transfer modlded electronic package having a passage means (1997-07-29),

15. 5622588 - Methods of making multi-tier laminate substrates for electronic device (1997-04-22),

Company Overview

Hestia Technologies, Inc. is a Santa Clara-based company specializing in advanced technology solutions for various industries. The organization focuses on developing innovative software and hardware products that enhance operational efficiency and drive digital transformation. With a strong emphasis on research and development, Hestia Technologies is dedicated to creating cutting-edge applications in fields such as cloud computing, data analytics, and IoT, positioning itself as a key player in the evolving tech landscape.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

17 Patents

#190 in Santa Clara, CA

#4,515 in California

#18,894 in US

#35,918 in the World

Santa Clara, CA, United States of America

Hestia Technologies, Inc.

Forward Citations = 593

3 inventors:

Patrick O Weber (17 out of 22 patents)

Michael A Brueggeman (3 out of 3 patents)

Matthew M Salatino (1 out of 20 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Hestia Technologies, Inc.. Retrieved from https://idiyas.com/company/hestia-technologies

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]