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Forward Citations = 590

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3 inventors (with patents filed for the assignee):

Patrick O Weber (17 out of 22 patents)

Michael A Brueggeman (3 out of 3 patents)

Matthew M Salatino (1 out of 20 patents)

17 patents: Sort by Forward Citations

1. 7049166 - Methods and apparatus for making integrated circuit package including opening exposing portion of the IC (2006-05-23),

2. 6560122 - Chip package with molded underfill (2003-05-06),

3. 6495083 - Method of underfilling an integrated circuit chip (2002-12-17),

4. 6324069 - Chip package with molded underfill (2001-11-27),

5. 6316291 - Method of fabricating a non-laminate carrier substrate utilizing a mold (2001-11-13),

6. 6128195 - Transfer molded PCMCIA standard cards (2000-10-03),

7. 6038136 - Chip package with molded underfill (2000-03-14),

8. 5929522 - Semiconductor non-laminate package and method (1999-07-27),

9. 5798014 - Methods of making multi-tier laminate substrates for electronic device (1998-08-25),

10. 5776512 - Apparatus for encapsulating electronic packages (1998-07-07),

11. 5766986 - Method of transfer molding electronic packages and packages produced (1998-06-16),

12. 5728248 - Method for making a multi-tier laminate substrate with internal heat (1998-03-17),

13. 5689137 - Method for transfer molding standard electronic packages and apparatus (1997-11-18),

14. 5652463 - Transfer modlded electronic package having a passage means (1997-07-29),

15. 5622588 - Methods of making multi-tier laminate substrates for electronic device (1997-04-22),

Hestia Technologies, Inc. is a leading provider of innovative technology solutions for businesses. With a focus on cutting-edge software development, cloud services, and IT consulting, Hestia Technologies helps companies optimize their operations and improve efficiency. Their team of experts is dedicated to delivering high-quality, customized solutions to meet the unique needs of each client. Visit their website to learn more about their services and how they can help your business thrive.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 6 2026

17 Patents

#232 in Santa Clara, CA

#4,381 in California

#18,344 in US

#34,877 in the World

Santa Clara, CA, United States of America

Hestia Technologies, Inc.

Forward Citations = 590

3 inventors:

Patrick O Weber (17 out of 22 patents)

Michael A Brueggeman (3 out of 3 patents)

Matthew M Salatino (1 out of 20 patents)

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