The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 1997
Filed:
Oct. 16, 1995
Applicant:
Inventor:
Patrick O Weber, San Jose, CA (US);
Assignee:
Hestia Technologies, Inc., Sunnyvale, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257679 ; 257667 ; 257693 ; 257787 ; 437214 ; 437219 ; 361737 ; 26427217 ;
Abstract
A method for transfer molding a standard electronic package and an apparatus resulting from such method. A seal is formed between a portion of the mold platens of the mold and a portion of a printed circuit board adjacent to electrical contacts along at least one side of the printed circuit board. After the apparatus is removed from the mold, a protective cap is placed over the electrical contacts.