The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 1998
Filed:
Oct. 16, 1996
Applicant:
Inventor:
Patrick O Weber, San Jose, CA (US);
Assignee:
Hestia Technologies, Inc., Sunnyvale, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
156263 ; 29830 ; 839291 ; 156150 ; 1562728 ; 174 524 ; 216 20 ;
Abstract
A method for making multi-tier laminate substrates for electronic device packaging is provided wherein a spacing mechanism is used to protect the bond fingers of a trace on a lower tier of the laminated substrate when a milling bit is used to cut an opening above a die cavity in the multi-tier substrate.
Weber, Patrick. (1998). Methods of making multi-tier laminate substrates for electronic device (U.S. Patent No. 5798014). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5798014
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile