The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 1997
Filed:
May. 26, 1995
Applicant:
Inventors:
Patrick O Weber, San Jose, CA (US);
Michael A Brueggeman, Mountain View, CA (US);
Assignee:
Hestia Technologies, Inc., Sunnyvale, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257706 ; 257667 ; 257707 ; 257787 ; 257790 ; 361709 ; 361719 ;
Abstract
A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink to encapsulate the package.