EPO Patents = 1

Forward Citations = 339

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6 inventors (with patents filed for the assignee):

Peter Elenius (4 out of 10 patents)

Harry Hollack (3 out of 3 patents)

Jamin Ling (1 out of 3 patents)

4. Deok-Hoon Kim (1 out of 1 patent)

5. Dave Charles Stepniak (1 out of 1 patent)

6. Michael E Johnson (6 patents)

5 patents: Sort by Forward Citations

1. 6750135 - Method for forming chip scale package (2004-06-15),

2. 6578755 - Polymer collar for solder bumps (2003-06-17),

3. 6445069 - Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method therefor (2002-09-03),

4. 6441487 - Chip scale package using large ductile solder balls (2002-08-27),

5. 6287893 - Method for forming chip scale package (2001-09-11),

Flip Chip Technologies, L.l.c. is a leading provider of advanced semiconductor packaging solutions. With over 20 years of experience, our innovative technologies enable high-performance, high-density integrated circuits for a wide range of applications. We specialize in flip chip interconnects, wafer bumping, and advanced assembly services to meet the demanding requirements of the semiconductor industry.

This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 2 2025

5 Patents

#173 in Phoenix, AZ

#688 in Arizona

#50,139 in US

Phoenix, AZ, United States of America

Flip Chip Technologies, L.l.c.