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Cham, Switzerland

Esec Sa

USPTO Granted Patents = 18

Forward Citations = 498

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26 inventors (with patents filed for the assignee):

Claudio Meisser (4 out of 21 patents)

Hans Egger (3 out of 4 patents)

Walter Nehls (3 out of 3 patents)

4. Armin Felber (2 out of 18 patents)

5. Guido Suter (2 out of 4 patents)

6. Marit Seidel (2 out of 2 patents)

7. Daniel Von Flue (2 out of 2 patents)

8. Christoph B Luchinger (2 out of 2 patents)

9. Hans Eggenschwiler (2 out of 2 patents)

10. Christof Koster (1 out of 4 patents)

11. Eugen Mannhart (1 out of 6 patents)

12. Samuel Schindler (1 out of 2 patents)

13. Thomas Guenther (1 out of 1 patent)

14. Alois Ulrich (1 out of 1 patent)

15. Matthias Krieger (1 out of 1 patent)

18 patents: Sort by Forward Citations

1. 6185815 - Semiconductor mounting apparatus with a chip gripper travelling back and forth (2001-02-13),

2. 6179938 - Method and apparatus for aligning the bonding head of a bonder, in particular a die bonder (2001-01-30),

3. 6135339 - Ultrasonic transducer with a flange for mounting on an ultrasonic (2000-10-24),

4. 6131799 - Method of making wire connections of predetermined shape (2000-10-17),

5. 6129040 - Semi-conductor mounting apparatus for applying adhesive to a substrate (2000-10-10),

6. 6119926 - Method for producing wire connections on semiconductor chips (2000-09-19),

7. 6056184 - Apparatus for shaping liquid portions of solder in soft soldering (2000-05-02),

8. 6010057 - Method for making a wire connections of predetermined shape (2000-01-04),

9. 5893509 - Apparatus for making wire connections on semiconductor chips (1999-04-13),

10. 5878939 - Method and apparatus for dispensing liquid solder (1999-03-09),

11. 5598270 - Sensor device and position determination process and their use for the (1997-01-28),

12. 5569402 - Curing oven for magazine holding computer chip lead frames, providing (1996-10-29),

13. 5263631 - Contact-making system for semiconductor wire connections (1993-11-23),

14. 5199630 - Method and apparatus for measuring the vibration amplitude on an energy (1993-04-06),

15. 5163222 - Method and apparatus for loading metal leadframes with electronic (1992-11-17),

Company Overview

Esec Sa, based in Cham, Switzerland, specializes in advanced semiconductor packaging and assembly solutions. The company focuses on developing innovative technologies that enhance the performance and reliability of electronic components. Esec Sa is recognized for its expertise in the fields of microelectronics and automation, providing tailored solutions for various industries, including telecommunications and automotive. Their commitment to research and development ensures they remain at the forefront of technological advancements in the semiconductor sector.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

18 Patents

#7 in Cham

#688 in Switzerland

#34,217 in the World

Cham, Switzerland

Esec Sa

Forward Citations = 498

26 inventors:

Claudio Meisser (4 out of 21 patents)

Hans Egger (3 out of 4 patents)

Walter Nehls (3 out of 3 patents)

4. Armin Felber (2 out of 18 patents)

5. Guido Suter (2 out of 4 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Esec Sa. Retrieved from https://idiyas.com/company/esec-sa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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