The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2000
Filed:
Jan. 07, 1999
Hans Egger, Sins, CH;
Marit Seidel, Unterageri, CH;
Esec SA, Cham, CH;
Abstract
In a method of making a wire connection of predetermined shape between a first connecting point located on a semiconductor chip and a second connecting point a capillary is moved along a predetermined trajectory. After attaching the wire at the first connecting point the capillary is moved up to a first point for the performing of one or two kinks and for the pulling out of the wire as far as the required total length of the wire connection. From the first point, the capillary is moved along a circular arc up to a second point, at which the wire is locked in the capillary. The circular arc is centered in the first connecting point or in the immediate vicinity of the first connecting point. The method is suitable for the wiring of CSPs (Chip Scale Packages). The movement along the circular arc prevents the wire from being pushed back through the capillary. As soon as the wire is locked in the capillary, the second connecting point can be approached without difficulty.