Company Filing History:
Years Active: 2001
Title: Matthias Krieger: Innovator in Bonding Technology
Introduction
Matthias Krieger is a notable inventor based in Steinhausen, Switzerland. He has made significant contributions to the field of bonding technology, particularly in the semiconductor industry. His innovative approach has led to the development of a unique method for aligning bonding heads in die bonders.
Latest Patents
Krieger holds a patent for a "Method and apparatus for aligning the bonding head of a bonder, in particular a die bonder." This patent outlines a systematic approach to align the bonding head, which is crucial for ensuring precision in semiconductor chip bonding. The method involves several steps, including the placement of an alignment plate, calibration of a measuring device, and the alignment of the bonding head based on the signals received from the measuring device. This innovation enhances the accuracy and efficiency of the bonding process.
Career Highlights
Matthias Krieger is associated with Esec SA, a company known for its advanced bonding solutions. His work at Esec SA has positioned him as a key player in the development of innovative bonding technologies. With a focus on precision and efficiency, Krieger's contributions have been instrumental in advancing the capabilities of die bonders.
Collaborations
Krieger has collaborated with notable colleagues, including Eugen Mannhart and Alois Ulrich. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas within the field.
Conclusion
Matthias Krieger's work in bonding technology exemplifies the impact of innovation in the semiconductor industry. His patent and contributions to Esec SA highlight his commitment to advancing technology and improving manufacturing processes. His achievements serve as an inspiration for future inventors in the field.