The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2001
Filed:
Oct. 19, 1998
Eugen Mannhart, Cham, CH;
Alois Ulrich, Zug, CH;
Thomas Guenther, Thalwil, CH;
Matthias Krieger, Steinhausen, CH;
Esec SA, Cham, CH;
Abstract
A method of aligning the bonding head of a bonder, in particular a die bonder, or of a pick and place machine comprising the steps of a) placing an alignment plate provided with two plane parallel surfaces on a supporting surface which is set plane parallel to the bonding surface upon which the semiconductor chip will be bonded to the carrier material; b) calibration of a measuring device, the signal of which is dependent upon the position of the alignment plate; c) grasping the alignment plate with the bonding head of the bonder and holding the alignment plate free at a slight distance above the measuring device; and d) alignment of the bonding head until the signal from the measuring device is equal to the signal following step b).