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For the Inventor, By the Inventor

Tokyo, Japan

Electroplating Engineers of Japan Limited


USPTO Granted Patents = 46


Trademarks = 2

Forward Citations = 497

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30 inventors (with patents filed for the assignee):

goldMedal Yasuhiko Sakaki (7 out of 7 patents)

silverMedal Junichi Tezuka (7 out of 7 patents)

bronzeMedal Kenji Yamamoto (6 out of 6 patents)

4.  Kazuhiro Taniguchi (5 out of 5 patents)

5.  Hiroshi Wachi (5 out of 6 patents)

6.  Hirofumi Ishida (4 out of 7 patents)

7.  Soumei Yarita (4 out of 4 patents)

8.  Yasuto Murata (4 out of 4 patents)

9.  Katsutsugu Kitada (3 out of 7 patents)

10.  Yutaka Otani (3 out of 4 patents)

11.  Masato Ando (3 out of 3 patents)

12.  Masahiro Ito (2 out of 4 patents)

13.  Takanobu Asakawa (2 out of 2 patents)

14.  Takayuki Sone (2 out of 2 patents)

15.  Katsunori Hayashi (2 out of 18 patents)


Core Competencies:
Electroless Plating
Gold Plating
Platinum Electroforming
Palladium Plating
Wafer Plating
Plating Apparatus
Non-Cyanide Plating
Automatic Plating Equipment
High-Speed Nickel Plating
Metal Coating
Connector Terminal Plating
Plating Method

46 patents:

1. 10306774 - Laminate structure of metal coating (2019-05-28),
2. 10301734 - Non-cyanide based Au—Sn alloy plating solution (2019-05-28),
3. 9932676 - Pretreatment solution for electroless plating and electroless plating method (2018-04-03),
4. 8771409 - Electroless gold plating solution and electroless gold plating method (2014-07-08),
5. 7887692 - Palladium plating solution (2011-02-15),
6. 7799186 - Plating apparatus (2010-09-21),
7. 7179359 - Cup-shaped plating apparatus (2007-02-20),
8. 7108776 - Plating apparatus and plating method (2006-09-19),
9. 6991711 - Cup type plating apparatus (2006-01-31),
10. 6875333 - Plating apparatus for wafer (2005-04-05),
11. 6767392 - Displacement gold plating solution (2004-07-27),
12. 6610182 - Cup-type plating apparatus and method for plating wafers (2003-08-26),
13. 6511589 - Gold plating solution and gold plating method using thereof (2003-01-28),
14. 6482300 - Cup shaped plating apparatus with a disc shaped stirring device having an opening in the center thereof (2002-11-19),
15. 6454918 - Cup type plating apparatus (2002-09-24),
Electroplating Engineers of Japan Limited (EEJ) is a leading provider of electroplating solutions and equipment. With over 50 years of experience, EEJ offers a wide range of innovative and high-quality electroplating services for various industries, including automotive, aerospace, electronics, and more. We specialize in custom plating solutions, corrosion resistance coatings, decorative coatings, and surface finishing solutions. Our team of highly skilled engineers and technicians are committed to delivering superior quality and customer satisfaction. Visit our website to learn more about our offerings and how we can assist you with your electroplating needs.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 30 2025

46 Patents

#732 in Tokyo

#1,768 in Japan

#14,688 in the World

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Tokyo, Japan

Electroplating Engineers of Japan Limited

Forward Citations = 497

30 inventors:

goldMedal Yasuhiko Sakaki (7 out of 7 patents)

silverMedal Junichi Tezuka (7 out of 7 patents)

bronzeMedal Kenji Yamamoto (6 out of 6 patents)

4.  Kazuhiro Taniguchi (5 out of 5 patents)

5.  Hiroshi Wachi (5 out of 6 patents)

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