The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2003
Filed:
Jun. 18, 2001
Yasuhiko Sakaki, Hiratsuka, JP;
Electroplating Engineers of Japan, Limited, Tokyo, JP;
Abstract
The present cup-type plating apparatus improves a conventional cup-type plating apparatus and prevents the surface of a wafer due to a mist of the plating solutions from being contaminated. A plating solution is supplied to a wafer which is placed on a wafer support provided along an opening at the top of a plating tank from a solution-supply port provided at the bottom of the plating tank by an upward-moving stream; the plating solution is made to flow out of a solution-outlet port provided for the plating tank; and plating is performed while the plating solution is brought into contact with a surface of the placed wafer, which is to be plated, wherein the solution-outlet port has a solution-outlet path in which the discharged plating solution is isolated from the outer space.