The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2011
Filed:
Feb. 27, 2007
Shingo Watanabe, Hiratsuka, JP;
Junji Ohnishi, Hiratsuka, JP;
Hiroshi Wachi, Hiratsuka, JP;
Takayuki Sone, Hiratsuka, JP;
Shingo Watanabe, Hiratsuka, JP;
Junji Ohnishi, Hiratsuka, JP;
Hiroshi Wachi, Hiratsuka, JP;
Takayuki Sone, Hiratsuka, JP;
Electroplating Engineers of Japan Limited, Tokyo, JP;
Abstract
The invention provides a plating solution capable of forming a palladium plating film which can further improve solder characteristics in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on a surface of a conductor formed from a metal such as copper. In a palladium plating solution of the invention containing a soluble palladium salt and an electrically conductive salt having a liquid composition containing germanium, the amount of the soluble palladium salt is 0.1 g/l to 50 g/l in terms of a reduced value of palladium metal, the amount of the electrically conductive salt is 10 g/l to 400 g/l and the amount of the germanium is 0.1 mg/l to 1000 mg/l.