Kanagawa, Japan

Hiroshi Wachi

This inventor holds 6 USPTO granted patents and 1 EPO patent. Top assignees: Electroplating Engineers of Japan Limited, Electroplating Engineer of Japan, Limited. Active years: 1996-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroshi Wachi. Retrieved from https://idiyas.com/inventor/hiroshi-wachi-p5bvvlsk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 2.2

ph-index = 2

Forward Citations = 16(Granted Patents)


Location History:

  • Koza-gun, JP (1996 - 1997)
  • Kanagawa-ken, JP (1997)
  • Hiratsuka, JP (2011)

Company Filing History:


Years Active: 1996-2011

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6 patents (USPTO):Explore Patents

Title: Hiroshi Wachi: Innovator in Plating Solutions

Introduction

Hiroshi Wachi is a notable inventor based in Kanagawa-ken, Japan. He has made significant contributions to the field of plating solutions, holding a total of six patents. His work focuses on improving the characteristics of plating films used in various applications.

Latest Patents

One of his latest inventions is a palladium plating solution. This innovative solution is capable of forming a palladium plating film that enhances solder characteristics in surface treatments. The composition includes a nickel plating film, a palladium plating film, and a gold plating film on a conductor surface made from metals like copper. The palladium plating solution contains a soluble palladium salt and an electrically conductive salt, with specific concentrations to optimize performance.

Another significant patent involves a plating method using an electroless gold plating solution. This method introduces air supply in the form of bubbles from dispersing bodies placed at the bottom of the plating tank. This technique allows for more uniform plating and prolongs the life of the plating solution. The air bubbles are supplied uniformly across the plating region, and the air supply is adjusted based on the liquid temperature of the solution.

Career Highlights

Hiroshi Wachi has worked with reputable companies, including Electroplating Engineers of Japan Limited and Electroplating Engineer of Japan, Limited. His experience in these organizations has contributed to his expertise in the field of plating technologies.

Collaborations

Throughout his career, Wachi has collaborated with notable colleagues, including Yutaka Otani and Takayuki Sone. These collaborations have further enriched his work and innovations in plating solutions.

Conclusion

Hiroshi Wachi's contributions to the field of plating solutions demonstrate his innovative spirit and dedication to improving technology. His patents reflect a commitment to enhancing the performance of plating films, making a significant impact in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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