The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Jun. 11, 2015
Applicant:

Electroplating Enginners of Japan Limited, Tokyo, JP;

Inventors:

Masahiro Ito, Hiratsuka, JP;

Yuichi Adachi, Hiratsuka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/18 (2006.01); C23C 18/16 (2006.01); C23C 18/30 (2006.01); C23C 18/32 (2006.01); C23C 18/42 (2006.01); C23C 18/44 (2006.01); C23C 18/31 (2006.01);
U.S. Cl.
CPC ...
C23C 18/18 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/1633 (2013.01); C23C 18/182 (2013.01); C23C 18/1841 (2013.01); C23C 18/1868 (2013.01); C23C 18/1889 (2013.01); C23C 18/30 (2013.01); C23C 18/31 (2013.01); C23C 18/32 (2013.01); C23C 18/42 (2013.01); C23C 18/44 (2013.01);
Abstract

The pretreatment solution for electroless plating of the present invention is composed of noble metal colloidal nanoparticles, a sugar alcohol, and water. The colloidal nanoparticles are gold, platinum, or palladium, have an average particle diameter of 5 to 80 nm, and are contained in the pretreatment solution in an amount of 0.01 to 10 g/L as metal mass. The sugar alcohol is at least one selected from the group consisting of tritol, tetritol, pentitol, hexitol, heptitol, octitol, inositol, quercitol, or pentaerythritol and is contained in the pretreatment solution in an amount of 0.01 to 200 g/L in total. The electroless plating method of the present invention uses the pretreatment solution and performs the electroless plating in an electroless plating bath.


Find Patent Forward Citations

Ito, Masahiro. (2018). Pretreatment solution for electroless plating and electroless plating method (U.S. Patent No. 9932676). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9932676

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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