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Hong Kong, China

Compass Technology Company Limited

USPTO Granted Patents = 20

Forward Citations = 29

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11 inventors (with patents filed for the assignee):

Chee Wah Cheung (19 out of 21 patents)

Kelvin Po Leung Pun (17 out of 19 patents)

Jason Rotanson (4 out of 4 patents)

4. Cheng Qiang Cui (3 out of 9 patents)

5. Wing Lung Hon (2 out of 2 patents)

6. Yam Chong (2 out of 2 patents)

7. Wai Yin Wong (2 out of 2 patents)

8. Shengbo Lu (2 out of 2 patents)

9. Chenmin Liu (2 out of 2 patents)

10. Kai C Ng (1 out of 1 patent)

11. Chee-Wah Cheung (1 out of 1 patent)

20 patents: Sort by Forward Citations

1. 12249704 - Method of direct embedding a lithium ion battery on a flexible printed circuit board (2025-03-11),

2. 11749595 - Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect (2023-09-05),

3. 11594509 - Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect (2023-02-28),

4. 11553598 - Integrated electro-optical flexible circuit board (2023-01-10),

5. 11076491 - Integrated electro-optical flexible circuit board (2021-07-27),

6. 11069606 - Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect (2021-07-20),

7. 10923449 - Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect (2021-02-16),

8. 10917973 - Method of direct embedding a lithium ion battery on a flexible printed circuit board (2021-02-09),

9. 10643942 - Formation of fine pitch traces using ultra-thin PAA modified fully additive process (2020-05-05),

10. 10636734 - Formation of fine pitch traces using ultra-thin PAA modified fully additive process (2020-04-28),

11. 10510653 - Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect (2019-12-17),

12. 10468342 - Formation of fine pitch traces using ultra-thin PAA modified fully additive process (2019-11-05),

13. 10362680 - Patterning of graphene circuits on flexible substrates (2019-07-23),

14. 10103095 - Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect (2018-10-16),

15. 9974188 - Patterning of graphene circuits on flexible substrates (2018-05-15),

Compass Technology Company Limited, based in Hong Kong, specializes in the development and manufacturing of advanced electronic components and systems. The company focuses on innovative solutions across various sectors, including consumer electronics, telecommunications, and industrial applications. With a commitment to research and development, Compass Technology aims to enhance product performance and reliability, positioning itself as a key player in the technology landscape of the region.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

20 Patents

#173 in Hong Kong

#1,468 in China

#31,233 in the World

Hong Kong, China

Compass Technology Company Limited

Forward Citations = 29

11 inventors:

Chee Wah Cheung (19 out of 21 patents)

Kelvin Po Leung Pun (17 out of 19 patents)

Jason Rotanson (4 out of 4 patents)

4. Cheng Qiang Cui (3 out of 9 patents)

5. Wing Lung Hon (2 out of 2 patents)

Please report any incorrect information to [email protected]

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