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Hong Kong, China

Compass Technology Company Limited

USPTO Granted Patents = 20

Forward Citations = 28

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11 inventors (with patents filed for the assignee):

Chee Wah Cheung (19 out of 21 patents)

Kelvin Po Leung Pun (17 out of 19 patents)

Jason Rotanson (4 out of 4 patents)

4. Cheng Qiang Cui (3 out of 9 patents)

5. Wing Lung Hon (2 out of 2 patents)

6. Yam Chong (2 out of 2 patents)

7. Wai Yin Wong (2 out of 2 patents)

8. Shengbo Lu (2 out of 2 patents)

9. Chenmin Liu (2 out of 2 patents)

10. Kai C Ng (1 out of 1 patent)

11. Chee-Wah Cheung (1 out of 1 patent)

20 patents: Sort by Forward Citations

1. 12249704 - Method of direct embedding a lithium ion battery on a flexible printed circuit board (2025-03-11),

2. 11749595 - Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect (2023-09-05),

3. 11594509 - Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect (2023-02-28),

4. 11553598 - Integrated electro-optical flexible circuit board (2023-01-10),

5. 11076491 - Integrated electro-optical flexible circuit board (2021-07-27),

6. 11069606 - Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect (2021-07-20),

7. 10923449 - Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect (2021-02-16),

8. 10917973 - Method of direct embedding a lithium ion battery on a flexible printed circuit board (2021-02-09),

9. 10643942 - Formation of fine pitch traces using ultra-thin PAA modified fully additive process (2020-05-05),

10. 10636734 - Formation of fine pitch traces using ultra-thin PAA modified fully additive process (2020-04-28),

11. 10510653 - Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect (2019-12-17),

12. 10468342 - Formation of fine pitch traces using ultra-thin PAA modified fully additive process (2019-11-05),

13. 10362680 - Patterning of graphene circuits on flexible substrates (2019-07-23),

14. 10103095 - Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect (2018-10-16),

15. 9974188 - Patterning of graphene circuits on flexible substrates (2018-05-15),

Compass Technology Company Limited is a leading provider of innovative technology solutions. We specialize in developing state-of-the-art software applications and providing cutting-edge hardware solutions to businesses across various industries. With a team of skilled professionals and a client-centric approach, we aim to deliver high-quality products and exceed customer expectations. Visit our website to learn more about our services and products.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

20 Patents

#164 in Hong Kong

#1,309 in China

#30,350 in the World

Hong Kong, China

Compass Technology Company Limited

Forward Citations = 28

11 inventors:

Chee Wah Cheung (19 out of 21 patents)

Kelvin Po Leung Pun (17 out of 19 patents)

Jason Rotanson (4 out of 4 patents)

4. Cheng Qiang Cui (3 out of 9 patents)

5. Wing Lung Hon (2 out of 2 patents)

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