Company Filing History:
3 out of 20 
2 out of 815 
1 out of 80 
Years Active: 1995-2013
Title: Innovations of Cheng Qiang Cui
Introduction
Cheng Qiang Cui is a prominent inventor based in Singapore, known for his significant contributions to the field of integrated circuit packaging. With a total of nine patents to his name, he has made remarkable advancements in thermal performance and solder ball attachment methods.
Latest Patents
One of his latest patents is a multiple integrated circuit die package with enhanced thermal performance. This invention involves a method of assembling a multi-die package where a heat spreader is placed on a printed circuit substrate. At least one integrated circuit die is positioned on the top side of the heat spreader, while another die is located on the bottom side. The dies are connected to the substrate through wire bonds, and thermal solder balls are used to connect the heat spreader to the substrate, functioning as a ground plane. This innovative design allows for improved thermal management in electronic devices.
Another notable patent is the solder ball attachment ring and method of use. This method involves applying flux to a bonding pad, attaching a conductive metal ring to the pad, and placing a solder ball within the ring. A reflow operation secures the ring to the pad and melts the solder ball, forming a reliable solder joint. This technique enables a higher stand-off height with a similar solder ball size, enhancing board-level reliability without the risk of solder ball bridging.
Career Highlights
Cheng Qiang Cui has worked with various companies, including Compass Technology Company Limited, where he has honed his skills in integrated circuit technology. His innovative approaches have led to significant advancements in the industry.
Collaborations
Throughout his career, Cheng has collaborated with notable professionals such as Thiam Beng Lim and Chee Wah Cheung. These collaborations have contributed to the development of cutting-edge technologies in the field of electronics.
Conclusion
Cheng Qiang Cui's contributions to integrated circuit packaging and soldering techniques have established him as a leading inventor in his field. His innovative patents continue to influence the electronics industry, showcasing his expertise and commitment to advancing technology.