This inventor holds 1 USPTO granted patent. Top assignee: Compass Technology Company Limited. Active years: 2009.
Company Filing History:
Years Active: 2009
Title: Innovations by Inventor Kai C Ng
Introduction
Kai C Ng is an accomplished inventor based in East Meadow, NY (US). He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of a unique patent that enhances the functionality and efficiency of electronic devices.
Latest Patents
One of Kai C Ng's notable patents is titled "Die-up integrated circuit package with grounded stiffener." This invention involves a printed circuit substrate that is positioned on the bottom side of a stiffener. An integrated circuit (IC) die is placed on the top side of the stiffener, and it is electrically connected to the printed circuit substrate through wire bonding via an open slot in the stiffener. Importantly, the die is not wire bonded to the stiffener itself. Solder balls are attached to the bottom side of the substrate, connecting to ground bond fingers of the substrate. Additionally, these solder balls are directly attached to solderable pads on the bottom side of the stiffener through open holes or plated through-holes on the substrate. This design allows the stiffener to function as both a ground plane and a heat sink for effective power dissipation. This patent showcases his innovative thinking and technical expertise in the field.
Career Highlights
Kai C Ng is currently employed at Compass Technology Company Limited, where he continues to work on cutting-edge technologies. His role at the company allows him to apply his inventive skills and contribute to advancements in electronic packaging solutions.
Collaborations
Throughout his career, Kai has collaborated with talented individuals such as Cheng Qiang Cui and Chee Wah Cheung. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
In summary, Kai C Ng is a notable inventor whose work in integrated circuit packaging has led to significant advancements in the field. His patent demonstrates his ability to innovate and improve electronic device functionality. His contributions continue to impact the industry positively.