The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

May. 14, 2018
Applicant:

Compass Technology Company Limited, Hong Kong, HK;

Inventors:

Kelvin Po Leung Pun, Hong Kong, HK;

Chee Wah Cheung, Hong Kong, HK;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H01L 29/16 (2006.01); G06F 3/041 (2006.01); H05K 3/02 (2006.01); G06K 9/00 (2006.01); H05K 1/14 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0041 (2013.01); G06F 3/041 (2013.01); G06K 9/00013 (2013.01); H01L 29/1606 (2013.01); H05K 1/0278 (2013.01); H05K 1/0306 (2013.01); H05K 1/0326 (2013.01); H05K 1/0346 (2013.01); H05K 1/09 (2013.01); H05K 3/025 (2013.01); G06F 2203/04102 (2013.01); G06F 2203/04103 (2013.01); H05K 1/144 (2013.01); H05K 3/0064 (2013.01); H05K 3/027 (2013.01); H05K 3/381 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/042 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0376 (2013.01); H05K 2203/095 (2013.01); H05K 2203/1545 (2013.01);
Abstract

A process for forming a graphene circuit pattern on an object is described. A graphene layer is grown on a metal foil. A bonding layer is formed on a protective film and a surface of the bonding layer is roughened. The graphene layer is transferred onto the roughened surface of the bonding layer. The protective film is removed and the bonding layer is laminated to a first core dielectric substrate. The metal foil is etched away. Thereafter the graphene layer is etched using oxygen plasma etching to form graphene circuits on the first core dielectric substrate. The first core dielectric substrate having graphene circuits thereon is bonded together with a second core dielectric substrate wherein the graphene circuits are on a side facing the second core dielectric substrate wherein an air gap is left there between.


Find Patent Forward Citations

Loading…