For the Inventor, By the Inventor

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Hong Kong, China

Capcon Limited

USPTO Granted Patents = 3

Forward Citations = 1

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5 inventors (with patents filed for the assignee):

Hong Gang Wang (3 out of 3 patents)

Feng Yu (3 out of 3 patents)

Yang Li (3 out of 4 patents)

4. Yong Xin Wang (2 out of 10 patents)

5. Min Wang (1 out of 7 patents)

3 patents: Sort by Forward Citations

1. 11774935 - Apparatus, control method and control device of semiconductor packaging (2023-10-03),

2. 11189507 - Chip packaging apparatus and method thereof (2021-11-30),

3. 10734349 - Apparatus and method for packaging components (2020-08-04),

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USPTO Data Jan 1 1976 - Sep 29 2026

3 Patents

#934 in Hong Kong

#8,271 in China

Hong Kong, China

Capcon Limited

Forward Citations = 1

5 inventors:

Hong Gang Wang (3 out of 3 patents)

Feng Yu (3 out of 3 patents)

Yang Li (3 out of 4 patents)

4. Yong Xin Wang (2 out of 10 patents)

5. Min Wang (1 out of 7 patents)

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