Company Filing History:
Years Active: 2020-2023
Title: Innovations of Inventor Feng Yu
Introduction
Feng Yu is a notable inventor based in Singapore, recognized for his contributions to semiconductor packaging technology. With a total of three patents to his name, he has made significant advancements in the field.
Latest Patents
Feng Yu's latest patents include an "Apparatus, control method and control device of semiconductor packaging." This invention features a semiconductor packaging apparatus that includes a bonding device for attaching components to substrates, a motor for driving the bonding device, and a position sensor for detecting the bonding device's position. The motion control unit is designed to optimize the bonding process by updating commands based on touch information between the component and the substrate. Another significant patent is the "Chip packaging apparatus and method thereof," which describes a chip packaging apparatus comprising multiple chip supplying, processing, and transferring devices. This innovative design allows for the simultaneous processing and transfer of multiple chips, enhancing efficiency in chip packaging.
Career Highlights
Feng Yu is currently employed at Capcon Limited, where he continues to develop cutting-edge technologies in semiconductor packaging. His work has positioned him as a key player in the industry, contributing to advancements that improve manufacturing processes.
Collaborations
Feng Yu collaborates with talented individuals such as Hong Gang Wang and Yang Li, who contribute to his innovative projects and help drive the development of new technologies.
Conclusion
Feng Yu's contributions to semiconductor packaging through his patents and work at Capcon Limited highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of technology in this area.