The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Jan. 22, 2016
Applicant:

Capcon Limited, Hong Kong, CN;

Inventors:

Feng Yu, Singapore, SG;

Hong Gang Wang, Singapore, SG;

Yang Li, Singapore, SG;

Yong Xin Wang, Singapore, SG;

Assignee:

CAPCON LIMITED, Hong Kong, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/742 (2013.01); H01L 21/67144 (2013.01); H01L 21/67766 (2013.01); H01L 24/11 (2013.01); H01L 24/95 (2013.01); H01L 21/6838 (2013.01); H01L 24/75 (2013.01); H01L 2224/118 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/951 (2013.01);
Abstract

A component packaging apparatus includes: at least one component supply device; at least one component processing device, which is configured to process components provided by the component supply device; at least one component transfer device, each component transfer device respectively having multiple bond heads, each bond head transferring one of the said components which are processed by the component processing device; wherein the component processing device comprises a pick-up platform, which is configured to simultaneously arrange the multiple components, and the multiple bond heads are configured to pick up the multiple components simultaneously from the pick-up platform at one time. A method for packaging components is also provided.


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