Singapore, Singapore

Min Wang

USPTO Granted Patents = 6 

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2016-2023

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6 patents (USPTO):Explore Patents

Title: Min Wang: Innovator in Semiconductor Packaging and Seismic Exploration

Introduction

Min Wang is a prominent inventor based in Singapore, known for his contributions to semiconductor packaging and seismic exploration technologies. With a total of six patents to his name, he has made significant advancements in these fields, showcasing his expertise and innovative spirit.

Latest Patents

Among his latest patents is an apparatus, control method, and control device for semiconductor packaging. This invention includes a bonding device for attaching components to substrates, a motor for driving the bonding device along a predetermined motion trajectory, and a position sensor that detects the bonding device's position at specific time points. The motion control unit is designed to generate position-time commands based on bonding process requirements, optimizing the control flow using touch information between the component and the substrate. Another notable patent involves a method for seismic exploration using visco-acoustic full waveform inversion (FWI) to model velocity and quality factor Q for subsurface formations. This method employs frequency-dependent velocity to minimize cross-talk between Q and velocity, applicable to both isotropic and anisotropic media.

Career Highlights

Min Wang has worked with notable companies such as CGG Services SAS and CGG Services SA, where he has applied his innovative ideas to real-world challenges. His work has significantly impacted the fields of semiconductor technology and geophysical exploration.

Collaborations

Throughout his career, Min Wang has collaborated with talented individuals, including Yi Xie and Weiquan Xu, contributing to various projects and enhancing the scope of his inventions.

Conclusion

Min Wang's contributions to semiconductor packaging and seismic exploration demonstrate his innovative capabilities and commitment to advancing technology. His patents reflect a deep understanding of complex systems and a drive to improve existing methodologies.

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