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Niederönz, Switzerland

Bystronic Laser Ag

USPTO Granted Patents = 95

% Expired Patents = 2.1

EPO Patents = 118

Trademarks = 19

Forward Citations = 912

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100 inventors (with patents filed for the assignee):

Andreas Luedi (12 out of 13 patents)

Simon Scheidiger (8 out of 9 patents)

Titus Haas (8 out of 8 patents)

4. Roland Bader (7 out of 7 patents)

5. Lars Woidasky (7 out of 7 patents)

6. Markus Steinlin (7 out of 7 patents)

7. Michael Berger (6 out of 7 patents)

8. Friedemann Seibert (4 out of 4 patents)

9. Stefan Wittwer (4 out of 4 patents)

10. Daniel Cathry (4 out of 4 patents)

11. Martin Mumenthaler (4 out of 5 patents)

12. Hans-Jorg Peter Neuhaus (4 out of 4 patents)

13. Ernest Imboden (3 out of 3 patents)

14. Stefan Alfons Jacobi (3 out of 3 patents)

15. Andreas Lüdi (3 out of 3 patents)

Core Competencies:

Laser Cutting

Beam Shaping

Quality Control

Machining Apparatus

Optical Device

Dynamic Laser Beam

Bending Machine

Workpiece Support

Sorting System

Laser Process Monitoring

Robot Control Program

Machine Learning

95 patents: Sort by Forward Citations

1. 12722232 - Laser processing machine, in particular laser cutting machine, with a spark protection device (2026-09-01),

2. 12708965 - CONTROL OF A LASER CUTTING MACHINE BY MEANS OF AIRBORNE SOUND SIGNALS (2026-08-18),

3. 12703019 - Bending machine, in particular a press brake, with a safety system (2026-08-11),

4. 12669801 - Thickness compensation in a cutting and bending process (2026-06-30),

5. 12594624 - Machining apparatus for laser machining a workpiece, method for laser machining a workpiece (2026-04-07),

6. 12528140 - Optical device for shaping an electromagnetic wave beam and use thereof, beam treatment device and use thereof, and beam treatment method (2026-01-20),

7. 12521817 - Determination of contour fidelity for a laser cutting machine (2026-01-13),

8. 12502733 - Laser cutting method and machine (2025-12-23),

9. 12502728 - Detection of foreign parts and slag on a worktable (2025-12-23),

10. 12447558 - Workpiece support of a processing machine for flat workpieces and processing machine for flat workpieces comprising such a workpiece support and method for processing a flat workpiece using such a processing machine (2025-10-21),

11. 12434328 - Calibration of a quality estimator for a laser cutting method (2025-10-07),

12. 12285820 - Method, control unit and laser cutting system for combined path and laser process planning for highly dynamic real-time systems (2025-04-29),

13. 12275085 - Determination of transition phases for transforming different dynamic laser beam shapes for a laser cutting machine (2025-04-14),

14. 12269122 - Method, control unit and laser cutting system for combined path and laser process planning for highly dynamic real-time systems (2025-04-08),

15. 12269114 - Automatic determination of a dynamic laser beam shape for a laser cutting machine (2025-04-08),

Company Overview

Bystronic Laser AG, based in Niederönz, Switzerland, specializes in advanced laser machining technologies. The company develops and manufactures innovative solutions for laser cutting, beam shaping, and quality control, catering to diverse industrial applications. Bystronic's expertise extends to dynamic laser beam technologies and precision machining apparatus, enhancing efficiency and accuracy in metal processing. Their commitment to innovation positions them as a leader in the laser machining sector, serving clients globally with cutting-edge equipment and support.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

95 Patents

#1 in Niederönz

#173 in Switzerland

#8,099 in the World

Niederönz, Switzerland

Bystronic Laser Ag

Forward Citations = 912

100 inventors:

Andreas Luedi (12 out of 13 patents)

Simon Scheidiger (8 out of 9 patents)

Titus Haas (8 out of 8 patents)

4. Roland Bader (7 out of 7 patents)

5. Lars Woidasky (7 out of 7 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Bystronic Laser Ag. Retrieved from https://idiyas.com/company/bystronic-laser-ag

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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