The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Oct. 15, 2021
Applicant:

Bystronic Laser Ag, Niederönz, CH;

Inventors:

Markus Steinlin, Zürich, CH;

Titus Haas, Zofingen, CH;

Assignee:

BYSTRONIC LASER AG, Niederönz, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/38 (2014.01); B23K 26/03 (2006.01); G05B 19/18 (2006.01); B23K 101/06 (2006.01); B23K 101/18 (2006.01);
U.S. Cl.
CPC ...
B23K 26/38 (2013.01); B23K 26/03 (2013.01); G05B 19/182 (2013.01); B23K 2101/06 (2018.08); B23K 2101/18 (2018.08); G05B 2219/36199 (2013.01);
Abstract

In one aspect, the present invention relates to a control unit (RE) for calculating a spatially and time-resolved, combined setpoint data set (SW-DS) for open- and/or closed-loop control of a laser cutting process during laser cutting with a laser cutting machine (L), wherein a processor (P) is intended to access a process model (PM) in a first memory (SI) via a process interface (P-SS) and a machine model (MM) in a second memory (S2) via a machine interface (M-SS) in order, on the basis of an estimated status data of the laser cutting process and the movement process, to calculate the spatially and time-resolved, combined setpoint data set (SW-DS) with coordinated setpoints for the laser cutting process and setpoints for the movement process, taking into account the read-in sensor data.


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