The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Dec. 16, 2020
Applicant:

Bystronic Laser Ag, Niederoenz, CH;

Inventors:

Gerrit J. W. Gerritsen, Cuarnens, CH;

Wilfried Liegard, Bern, CH;

Assignee:

BYSTRONIC LASER AG, Niederoenz, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/4155 (2006.01); B23K 26/38 (2014.01);
U.S. Cl.
CPC ...
G05B 19/4155 (2013.01); B23K 26/38 (2013.01); G05B 2219/35519 (2013.01);
Abstract

The present invention relates to a computer-implemented method and a planer for calculating at least one supplementary processing plan for a workpiece to be processed by a processing machine. The method comprises the steps of: Measuring workpiece properties, including a thickness parameter of the workpiece; Providing at least one supplementary processing plan, which is specific for the measured workpiece properties. Due to the present invention, measurement of the workpiece properties is performed before starting to process the workpiece. Therefore, time and material can be saved, and scrap and waste are reduced.


Find Patent Forward Citations

Gerritsen, Gerrit J. W.. (2026). Thickness compensation in a cutting and bending process (U.S. Patent No. 12669801). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12669801

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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