This inventor holds 1 USPTO granted patent. Top assignee: Bystronic Laser Ag. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Gerrit J. W. Gerritsen: Inventor in Workpiece Processing
Introduction
Gerrit J. W. Gerritsen is an inventor associated with Bystronic Laser AG and based in Cuarnens, Switzerland. His patent work addresses thickness compensation in cutting and bending processes.
Latest Patents
Gerritsen is credited with 1 patent, titled “Thickness Compensation in a Cutting and Bending Process.” The invention describes a computer-implemented method and a planer for calculating a supplementary processing plan for a workpiece. It measures workpiece properties, including thickness, before processing and provides a plan tailored to those measurements. This approach can save time and material while reducing scrap and waste.
Career Highlights
Gerritsen’s listed patent is connected to Bystronic Laser AG, a company working in industrial processing technology. The invention focuses on adapting processing plans to measured workpiece characteristics.
Collaborations
Wilfried Liegard is identified as Gerritsen’s coworker. The available information does not specify their roles or describe a particular joint project.
Conclusion
Gerritsen’s patent highlights how measuring workpiece thickness before processing can support more efficient cutting and bending operations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile