For the Inventor, By the Inventor

Enter assignee name

Wauwatosa, WI, United States of America

Bostik, Inc.

Calculating rank

USPTO Granted Patents = 75

% Expired Patents = 5.3

CIPO Patents = 7

EPO Patents = 34

Trademarks = 31

Forward Citations = 483

Loading Chart...

Loading Chart...

90 inventors (with patents filed for the assignee):

Baoyu Wang (8 out of 14 patents)

Michael D Vitrano (8 out of 8 patents)

Monina Dadap Kanderski (8 out of 11 patents)

4. Kimberly Eileen Secrist (8 out of 8 patents)

5. Steven Daniel Gray (6 out of 55 patents)

6. Deepa Puthanparambil (6 out of 6 patents)

7. Kelley Gerschke (4 out of 4 patents)

8. Rodney M Weston (4 out of 4 patents)

9. Heinz G Gilch (4 out of 11 patents)

10. Miao Hu (3 out of 3 patents)

11. Michael A Chronister (3 out of 3 patents)

12. Kevin J Stafeil (3 out of 7 patents)

13. Jean-Francois Chartrel (3 out of 8 patents)

14. Richard Edward Hamann (3 out of 3 patents)

15. Terhi I Hawkins (3 out of 3 patents)

Core Competencies:

Hot Melt Adhesives

Polyolefin-Based

Moisture-Curing

Compostable Adhesives

Heat Seal Resins

Cohesively Failing

Styrene Copolymers

Absorbent Articles

High Performance Sealants

Plasticized Polymers

Adhesive Compositions

Thermal Management

75 patents: Sort by Forward Citations

1. 12686794 - Amorphous copolyester resins for use as a cold seal adhesive, coating compositions (2026-07-21),

2. 12570079 - Extrudable antifog copolyester heat seal resins (2026-03-10),

3. 12545821 - Compostable hot melt adhesive (2026-02-10),

4. 12371595 - Metallocene polyolefin based low activation temperature heat seal hot melt adhesive (2025-07-29),

5. 12247142 - Tackifier-free hot melt adhesive compositions suitable for use in a disposable hygiene article (2025-03-11),

6. 12245922 - Wetness indicator free from halogen-containing species (2025-03-11),

7. 11945977 - Styrene-based materials for hot melt adhesives (2024-04-02),

8. 11912906 - Hot melt adhesive containing a hydrogenated styrenic block copolymer and an ethylene vinyl acetate copolymer exhibiting low blocking force (2024-02-27),

9. 11851537 - Methods for making a plasticized polymer, methods for making a composition using the plasticized polymer, and compositions comprising the plasticized polymer (2023-12-26),

10. 11806971 - Extrudable antifog copolyester heat seal resins (2023-11-07),

11. 11661537 - Compostable hot melt adhesive (2023-05-30),

12. 11643578 - Hot melt positioning adhesive (2023-05-09),

13. 11365329 - Hot melt adhesive compositions based on propylene-based polymers and methods for using same (2022-06-21),

14. 11338565 - Method for improving creep performance in elastic applications (2022-05-24),

15. 11299657 - Polyolefin-based hot melt adhesives with improved properties (2022-04-12),

Company Overview

Bostik, Inc., headquartered in Wauwatosa, WI, specializes in the development and manufacturing of innovative hot melt adhesives. The company focuses on a diverse range of adhesive technologies, including polyolefin-based and moisture-curing solutions, as well as compostable adhesives and heat seal resins. Bostik's expertise extends to the formulation of styrene copolymers and cohesively failing adhesives, catering to various applications, particularly in absorbent articles. Their commitment to advancing adhesive technology positions them as a leader in the industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Nov 3 2026

75 Patents

#3 in Wauwatosa, WI

#112 in Wisconsin

#4,918 in US

#10,020 in the World

Wauwatosa, WI, United States of America

Bostik, Inc.

Forward Citations = 483

90 inventors:

Baoyu Wang (8 out of 14 patents)

Michael D Vitrano (8 out of 8 patents)

Monina Dadap Kanderski (8 out of 11 patents)

4. Kimberly Eileen Secrist (8 out of 8 patents)

5. Steven Daniel Gray (6 out of 55 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Bostik, Inc.. Retrieved from https://idiyas.com/company/bostik

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…