The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2024

Filed:

Jul. 11, 2014
Applicant:

Bostik, Inc., Wauwatosa, WI (US);

Inventors:

Kevin Stafeil, Delafield, WI (US);

Kathleen M Farris, West Allis, WI (US);

Assignee:

Bostik, Inc., Wauwatosa, WI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 157/02 (2006.01); A61L 15/24 (2006.01); A61L 15/58 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); C08L 23/08 (2006.01); C08L 53/02 (2006.01); C08L 91/00 (2006.01); C09J 11/08 (2006.01); C09J 123/08 (2006.01); C09J 153/02 (2006.01);
U.S. Cl.
CPC ...
C09J 157/02 (2013.01); A61L 15/24 (2013.01); A61L 15/585 (2013.01); B32B 5/022 (2013.01); B32B 5/26 (2013.01); B32B 7/12 (2013.01); B32B 37/1207 (2013.01); B32B 37/1292 (2013.01); C08L 23/0853 (2013.01); C08L 53/02 (2013.01); C08L 91/00 (2013.01); C09J 11/08 (2013.01); C09J 123/0853 (2013.01); C09J 153/02 (2013.01); B32B 2037/1215 (2013.01); B32B 2250/02 (2013.01); B32B 2250/20 (2013.01); B32B 2255/02 (2013.01); B32B 2255/26 (2013.01); B32B 2405/00 (2013.01); B32B 2439/00 (2013.01); B32B 2519/00 (2013.01); B32B 2535/00 (2013.01); B32B 2555/02 (2013.01); C09J 2301/304 (2020.08); Y02P 20/582 (2015.11); Y10T 428/2891 (2015.01); Y10T 442/60 (2015.04); Y10T 442/659 (2015.04); Y10T 442/674 (2015.04);
Abstract

A hot melt adhesive composed of an ethylene vinyl acetate copolymer, a hydrogenated styrenic block copolymer, a tackifying resin, and a liquid plasticizer. The preferred ethylene vinyl acetate copolymer has a vinyl acetate content between 8 and 28 percent by weight, and the preferred hydrogenated styrenic block copolymer is a styrene-ethylene-butylene-styrene having about 30% styrene content and essentially no diblock. The hot melt gives excellent peel strength when used as a construction adhesive for disposable nonwoven articles. It can also be formulated to exhibit very low bleed through and blocking characteristics when used on low basis weight nonwoven fabrics.


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