The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Oct. 20, 2021
Bostik, Inc., Wauwatosa, WI (US);
Deepa Puthanparambil, Wauwatosa, WI (US);
Tatiana Kretlow, Wauwatosa, WI (US);
Joshua T. Harju, Wauwatosa, WI (US);
Marie Hut, Wauwatosa, WI (US);
Bostik, Inc., Wauwatosa, WI (US);
Abstract
A method of adhering substrate surfaces to one another comprises applying a copolyester resin mixture to the surfaces and contacting the surfaces with one another in the absence of heat to form a cold seal. The copolyester resin may be sulfonated and the reaction product of (a) at least two diols comprising ethylene glycol at a mole fraction of at least about 0.25 and (b) at least three diacids or diesters comprising: (i) a sulfomonomer at a mole fraction of at least 0.02, preferably at least 0.07; (ii) at least one aromatic diacid or diester; and (iii) at least one aliphatic diacid or diester. The ratio of aromatic to aliphatic diacids or diesters may be between about 75/25 and about 45/55, and the glass transition temperature of the resin may be between about −25° C. and about 15° C. The resin may be solvated and preferably is food grade compliant and compostable.