Wauwatosa, WI, United States of America

Marie Hut

This inventor holds 1 USPTO granted patent. Top assignee: Bostik, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Marie Hut. Retrieved from https://idiyas.com/inventor/marie-hut

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Marie Hut and Cold-Seal Copolyester Adhesive Innovation.

Introduction

Marie Hut is an inventor associated with Wauwatosa, Wisconsin, and Bostik, Inc. Her patent work concerns copolyester resins designed for cold-seal adhesive and coating applications.

Latest Patents

Hut is associated with 1 patent: “Amorphous Copolyester Resins for Use as a Cold Seal Adhesive, Coating Compositions.” The invention describes adhering substrate surfaces without heat by applying a copolyester resin mixture and bringing the surfaces into contact.

The resin may be sulfonated and made from specified diols and diacids or diesters, including ethylene glycol, a sulfomonomer, aromatic components, and aliphatic components. The disclosed compositions can be formulated with a glass transition temperature between approximately −25°C and 15°C. The patent also describes resins that may be solvated and are preferably food-grade compliant and compostable.

Career Highlights

The patent reflects Hut’s contribution to adhesive and coating technology, particularly formulations intended to create seals without applying heat. Its described material properties and potential food-grade compliance and compostability address practical considerations in product and packaging applications.

Collaborations

Hut’s listed coworkers include Joshua T. Harju and Tatiana Kretlow. Her patent is associated with Bostik, Inc.

Conclusion

Marie Hut’s patent work focuses on amorphous copolyester formulations for cold-seal adhesives and coatings, highlighting an approach to bonding surfaces without heat.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…