Wauwatosa, WI, United States of America

Joshua T Harju

This inventor holds 1 USPTO granted patent. Top assignee: Bostik, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Joshua T Harju. Retrieved from https://idiyas.com/inventor/joshua-t-harju

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Joshua T. Harju: Patent Work in Cold-Seal Adhesive Resins

Introduction

Joshua T. Harju is an inventor associated with Wauwatosa, Wisconsin, and Bostik, Inc. His patent work includes a copolyester resin formulation designed for cold-seal adhesive and coating applications.

Latest Patents

Harju is credited with 1 patent: “Amorphous Copolyester Resins for Use as a Cold Seal Adhesive, Coating Compositions.” The invention describes adhering substrate surfaces by applying a copolyester resin mixture and bringing the surfaces together without heat.

The resin may be made from diols, including ethylene glycol, and diacids or diesters that include a sulfomonomer, an aromatic component, and an aliphatic component. The disclosed formulations may have a glass transition temperature between approximately −25°C and 15°C. The resin may also be solvated and designed to meet food-grade requirements and be compostable.

Career Highlights

Harju’s listed patent reflects work on adhesive materials that can form a seal without heat. Such formulations may be relevant to packaging and coating applications where cold-seal performance is useful.

Collaborations

The patent information names Deepa Puthanparambil and Tatiana Kretlow as Harju’s coworkers. The available details do not specify their individual contributions to the invention.

Conclusion

Joshua T. Harju’s patent documents a copolyester-based approach to cold-seal adhesives, with formulation features intended to support practical coating and packaging uses.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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