Forward Citations = 0

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13 inventors (with patents filed for the assignee):

Chieh Lin (2 out of 16 patents)

Chung-Jui Su (1 out of 7 patents)

Ming-Tsung Liang (1 out of 3 patents)

4. Chung-jui Su (1 out of 1 patent)

5. Yi-ying Wang (1 out of 1 patent)

6. Shang-che Lan (1 out of 1 patent)

7. Ming-tsung Liang (1 out of 1 patent)

8. Shuo Yan Ma (1 out of 1 patent)

9. Yuh-shyuan Lai (1 out of 1 patent)

10. Shuo-yen Ma (1 out of 1 patent)

11. Che-wei Chang (1 out of 1 patent)

12. Ching Feng Lin (1 out of 1 patent)

13. Shang-Che Lan (1 out of 1 patent)

5 patents: Sort by Forward Citations

1. 12738422 - Mobile device and wound capacitor package structure thereof (2026-09-15),

2. 12626864 - Capacitor assembly package structure and method of manufacturing the same, and electronic device (2026-05-12),

3. 12609248 - Conductive paste, manufacturing method thereof, capacitor element and manufacturing method thereof (2026-04-21),

4. 12586732 - Capacitor assembly package structure having outermost reinforcement structures (2026-03-24),

5. 12531190 - Movable device and wound capacitor package structure thereof (2026-01-20),

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

5 Patents

#25 in Miaoli

#2,367 in Taiwan

Miaoli, Taiwan

Apaq Technology Co., Ltd.

Forward Citations = 0

13 inventors:

Chieh Lin (2 out of 16 patents)

Chung-Jui Su (1 out of 7 patents)

Ming-Tsung Liang (1 out of 3 patents)

4. Chung-jui Su (1 out of 1 patent)

5. Yi-ying Wang (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Apaq Technology Co., Ltd.. Retrieved from https://idiyas.com/company/apaq-technology

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]