Chung-jui Su

Title: Chung-jui Su and His Capacitor Packaging Invention.

Introduction

Chung-jui Su is an inventor associated with Kaohsiung, Taiwan. His work includes a patent for a mobile device and a wound capacitor package structure, developed in connection with Apaq Technology Co., Ltd. The patent record provided lists 1 patent for him.

Latest Patents

Su’s patent, “Mobile Device and Wound Capacitor Package Structure Thereof,” describes a wound capacitor package designed to protect its internal assembly and maintain the alignment of its conductive pins. The structure includes a wound assembly, a conductive assembly with first and second conductive pins, and a packaging assembly.

A filling body encapsulates the wound assembly and part of the conductive assembly. A single-piece packaging casing accommodates the filling body and includes an annular deformation structure around the top filling material layer. The design is intended to prevent the casing structure from squeezing that layer or shifting the conductive pins relative to the wound assembly.

Career Highlights

Su’s listed patent reflects work on packaging structures for wound capacitors used in mobile devices. The invention focuses on encapsulation, component protection, and maintaining the position of electrical connections.

Collaborations

The patent information associates Su with Apaq Technology Co., Ltd. and identifies Ming-tsung Liang as a coworker.

Conclusion

Chung-jui Su’s patent addresses practical packaging challenges in mobile-device capacitors by combining an encapsulating filling body with a shaped casing intended to protect the assembly and preserve pin alignment.