The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

May. 28, 2024
Applicant:

Apaq Technology Co., Ltd., Miaoli County, TW;

Inventors:

Chung-Jui Su, Kaohsiung City, TW;

Ming-Tsung Liang, New Taipei City, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/32 (2006.01); H01G 4/224 (2006.01); H01G 4/236 (2006.01);
U.S. Cl.
CPC ...
H01G 4/224 (2013.01); H01G 4/236 (2013.01); H01G 4/32 (2013.01);
Abstract

A mobile device and a wound capacitor package structure thereof are provided. The wound capacitor package structure includes a wound assembly, a conductive assembly and a packaging assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The packaging assembly includes a filling body for completely encapsulating the wound assembly, and a single-piece packaging casing for accommodating the filling body. The filling body includes a bottom filling material layer configured to encapsulate the wound assembly and a part of the conductive assembly. The single-piece packaging casing has an annular deformation structure configured for surroundingly accommodating the top filling material layer. The top filling material layer of the filling body cannot be squeezed by the annular deformation structure, and the first conductive pin and the second conductive pin of the conductive assembly cannot be offset relative to the wound assembly by the annular deformation structure.


Find Patent Forward Citations

Su, Chung-Jui. (2026). Mobile device and wound capacitor package structure thereof (U.S. Patent No. 12738422). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12738422

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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