The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

May. 09, 2024
Applicant:

Apaq Technology Co., Ltd., Miaoli County, TW;

Inventors:

Shang-Che Lan, Kaohsiung City, TW;

Che-Wei Chang, Miaoli County, TW;

Shuo-Yen MA, Changhua County, TW;

Yuh-Shyuan Lai, Tainan City, TW;

Assignee:

APAQ TECHNOLOGY CO., LTD., Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/012 (2006.01); H01G 9/08 (2006.01); H01G 9/15 (2006.01);
U.S. Cl.
CPC ...
H01G 9/012 (2013.01); H01G 9/08 (2013.01); H01G 9/15 (2013.01);
Abstract

A capacitor assembly package structure includes a first bottom electrode structure, a second bottom electrode structure, a capacitor assembly and an insulating package body. The second bottom electrode structure is separate from the first bottom electrode structure. The capacitor assembly is disposed on the first bottom electrode structure and the second bottom electrode structure. The capacitor assembly includes a plurality of capacitor elements electrically connected to each other, and each capacitor element has a positive electrode portion electrically connected to the first bottom electrode structure and a negative electrode portion electrically connected to the second bottom electrode structure. The insulating package body is configured to cover the capacitor elements of the capacitor assembly. Each capacitor element has a raised protruding structure disposed on the positive electrode portion to reduce a shortest vertical distance between the positive electrode portion and the negative electrode portion of each capacitor element.


Find Patent Forward Citations

Lan, Shang-Che. (2026). Capacitor assembly package structure having outermost reinforcement structures (U.S. Patent No. 12586732). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12586732

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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