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Canonsburg, PA, United States of America

Ansys, Inc.

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USPTO Granted Patents = 215

EPO Patents = 1

Trademarks = 39

Forward Citations = 266

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341 inventors (with patents filed for the assignee):

Norman H Chang (29 out of 41 patents)

Deqi Zhu (18 out of 18 patents)

Joao Moreno Geada (16 out of 19 patents)

4. Jimin Wen (15 out of 15 patents)

5. Hsiming Pan (11 out of 11 patents)

6. Lang Lin (11 out of 11 patents)

7. Akhilesh Kumar (10 out of 10 patents)

8. Scott Johnson (9 out of 23 patents)

9. Altan Odabasi (7 out of 9 patents)

10. Dinesh Kumar Selvakumaran (7 out of 7 patents)

11. Saeed Asgari (7 out of 7 patents)

12. Wenbo Xia (6 out of 6 patents)

13. Wen-Tze Chuang (6 out of 6 patents)

14. Hua Chen (6 out of 7 patents)

15. Ping Zhou (6 out of 6 patents)

Core Competencies:

Additive Manufacturing

Heat Source Modeling

Layer-wise Behaviors

Thermal Analysis

Electro-Optical Modeling

Machine Learning

Simulation Methods

Mesh Generation

Finite Element Analysis

Dynamic Modeling

Transistor Reliability

Circuit Simulation

215 patents: Sort by Forward Citations

1. 12769917 - Simulation based analysis of electromagnetic fault injection (2026-10-20),

2. 12743569 - Electromagnetic modeling of superconductive circuits (2026-09-22),

3. 12742899 - Methods and systems for determining ground motion in a simulation of seismic soil-structure interaction (2026-09-22),

4. 12701003 - Machine learning for automatic identification of points of interest for side channel leakage (2026-08-04),

5. 12694183 - Multiscale thermal reduced order model for transient IC analysis (2026-07-28),

6. 12688653 - System and method of generating mesh representing flow domain (2026-07-21),

7. 12688339 - Methods and devices for computing a state of an electromechanical object (2026-07-21),

8. 12688252 - Simulation systems with mapping between non-conformal geometries (2026-07-21),

9. 12682572 - Adaptive mesh refinement techniques for three-dimensional stacked models (2026-07-14),

10. 12664325 - Creating virtual boundaries for modelling patterned boundary conditions within simulations (2026-06-23),

11. 12645857 - Systems and methods for blending AC and DC models for electromagnetic simulation (2026-06-02),

12. 12639621 - Automated generation of a machine learning model from computational simulation data (2026-05-26),

13. 12613503 - Techniques for solving additive manufacturing part analyses for powder bed fusion technologies (2026-04-28),

14. 12608514 - Determination of heat source absorptivity and penetration depth in additive manufacturing melt pools (2026-04-21),

15. 12596862 - Method and system to implement a composite, multi-domain model for electro-optical modeling and simulation (2026-04-07),

Company Overview

Ansys, Inc., headquartered in Canonsburg, PA, specializes in advanced simulation software that empowers engineers to design and optimize products across various industries. The company is a leader in additive manufacturing technologies, focusing on key areas such as heat source modeling, layer-wise behaviors, and thermal analysis. Ansys also integrates machine learning and electro-optical modeling into its simulation methods, enhancing the precision and efficiency of product development. Its innovative solutions support a wide range of applications, driving advancements in engineering and manufacturing.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

215 Patents

#1 in Canonsburg, PA

#83 in Pennsylvania

#1,951 in US

#3,984 in the World

Canonsburg, PA, United States of America

Ansys, Inc.

Forward Citations = 266

341 inventors:

Norman H Chang (29 out of 41 patents)

Deqi Zhu (18 out of 18 patents)

Joao Moreno Geada (16 out of 19 patents)

4. Jimin Wen (15 out of 15 patents)

5. Hsiming Pan (11 out of 11 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Ansys, Inc.. Retrieved from https://idiyas.com/company/ansys

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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