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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12769917 B1

PDFFull Text
Date of Patent:
Oct. 20, 2026

Filed:

Dec. 31, 2021

Simulation based analysis of electromagnetic fault injection

Applicant:

Ansys, Inc., Canonsburg, PA (US);

Inventors:

Deqi Zhu, San Jose, CA (US);

Lang Lin, Cupertino, CA (US);

Norman Chang, Fremont, CA (US);

Jimin Wen, Pleasanton, CA (US);

Yu Lu, San Ramon, CA (US);

Hua Chen, Chengdu, CN;

Sreeja Chowdhury, San Jose, CA (US);

Harsh Shrivastav, Milpitas, CA (US);

Assignee:

ANSYS, INC., Canonsburg, PA (US);

Attorney:

WOMBLE BOND DICKINSON (US) LLP

Primary Examiner:

Rehana Perveen

Assistant Examiner:

Kyle H Tseng

Int. Cl.
CPC ...
G06F 30/367 (2020.01); G06F 117/02 (2020.01); G06F 119/06 (2020.01); G06F 119/12 (2020.01);
U.S. Cl.
CPC ...
G06F 30/367 (2020.01); G06F 2117/02 (2020.01); G06F 2119/06 (2020.01); G06F 2119/12 (2020.01);
Abstract

Simulation systems and methods described in this disclosure can create simulations of electromagnetic fault injection (EMFI), from a simulated probe, into a simulated circuit to evaluate and rank EMFI vulnerabilities in the circuit. A method in one embodiment can include the operations of: applying a simulated source of electromagnetic radiation near a surface of a circuit in a simulation of the circuit; computing a simulated set of induced voltages in the circuit as a result of the application of the simulated source near the surface of the circuit; and determining from the set of induced voltages a set of fault vulnerabilities in the circuit.

Find Patent Forward Citations

Zhu, Deqi. (2026). Simulation based analysis of electromagnetic fault injection (U.S. Patent No. 12769917). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12769917

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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