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Seongnam, South Korea

Adp Engineering Co., Ltd.

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USPTO Granted Patents = 18

% Expired Patents = 100.0

Forward Citations = 139

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13 inventors (with patents filed for the assignee):

Jae Seok Hwang (6 out of 7 patents)

Hyoung Kyu Son (3 out of 6 patents)

Seok Hee Shim (3 out of 3 patents)

4. In Taek Lee (3 out of 3 patents)

5. Kyung Mi Kim (2 out of 2 patents)

6. Dong Gun Kim (2 out of 3 patents)

7. Bong Hwan Choi (2 out of 2 patents)

8. Young Ung An (1 out of 1 patent)

9. Jong Yeoul Ji (1 out of 1 patent)

10. Sang Leoul Kim (1 out of 1 patent)

11. Si Hyun Park (1 out of 1 patent)

12. Young Joo Hwang (1 out of 2 patents)

13. Ki Taek Jung (1 out of 1 patent)

18 patents: Sort by Forward Citations

1. 8845810 - Substrate damage prevention system and method (2014-09-30),

2. 8834673 - Process chamber having gate slit opening and closing apparatus (2014-09-16),

3. 8617314 - Organic deposition apparatus and method of depositing organic substance using the same (2013-12-31),

4. 8529715 - Apparatus for attaching substrates and gap control unit thereof (2013-09-10),

5. 8462009 - System and method for introducing a substrate into a process chamber (2013-06-11),

6. 8462008 - System and method for introducing a substrate into a process chamber (2013-06-11),

7. 8388781 - Apparatus for attaching substrates and gap control unit thereof (2013-03-05),

8. 8363377 - Electrostatic chuck and apparatus having the same (2013-01-29),

9. 8256101 - Apparatus for attaching substrates of flat display panel (2012-09-04),

10. 8072573 - Apparatus and method for attaching substrates (2011-12-06),

11. 7988817 - Lift pin driving device and a flat panel display manufacturing apparatus having same (2011-08-02),

12. 7980287 - Adhesive chuck and substrate bonding apparatus (2011-07-19),

13. 7896046 - Substrate bonding apparatus having alignment unit and method of aligning substrates using the same (2011-03-01),

14. 7864289 - Apparatus and method for attaching substrates (2011-01-04),

15. 7770478 - Apparatus and method for measuring chuck attachment force (2010-08-10),

Company Overview

Adp Engineering Co., Ltd. is a South Korean company specializing in advanced engineering solutions and technology development. The organization focuses on various sectors, including automotive engineering, electronics, and industrial automation. With a commitment to innovation, Adp Engineering leverages cutting-edge research to enhance product performance and efficiency. The company plays a significant role in the regional technology landscape, contributing to the advancement of engineering practices and solutions tailored to meet diverse industry needs.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

18 Patents

#39 in Seongnam

#690 in South Korea

#34,263 in the World

Seongnam, South Korea

Adp Engineering Co., Ltd.

Forward Citations = 139

13 inventors:

Jae Seok Hwang (6 out of 7 patents)

Hyoung Kyu Son (3 out of 6 patents)

Seok Hee Shim (3 out of 3 patents)

4. In Taek Lee (3 out of 3 patents)

5. Kyung Mi Kim (2 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Adp Engineering Co., Ltd.. Retrieved from https://idiyas.com/company/adp-engineering-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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